Brief introduction UNIPOL-160D double side lapping and polishing machine is mainly used for precision polishing of quartz wafer, sapphire, ceramic, glass, metal and other sheet materials. The machine with worm and worm wheel reducer for transmission mechanism, rotation through a gear set to achieve, three - axis at different speeds, different direction, make, grinding polishing disc and in the middle of the sun wheel speed difference and relative motion, and sample is placed in the sun wheel drive of the loading gear wheel hole, thus the were double-sided grinding and polishing. Features 1, the speed of manual adjustment of the frequency control mode. 2, at the same time 4 maximum size of phi 2 "substrate of double-sided polishing. 3, can be a thin sheet of thinning. 4, Si, Ge double-sided polishing oxide single crystal substrate, the ideal tool. Technical parameter 1, power: 220V 50Hz 2, power: 550W 3, grinding disc: 225mm 4, grinding disc speed: stepless adjustable 0-72rpm 5, the maximum sample size: 50mm diameter, thickness of less than 15mm 6, grinding disc weight: 3.5kg
Brief introduction UNIPOL-160D double side lapping and polishing machine is mainly used for precision polishing of quartz wafer, sapphire, ceramic, glass, metal and other sheet materials. The machine with worm and worm wheel reducer for transmission mechanism, rotation through a gear set to achieve, three - axis at different speeds, different direction, make, grinding polishing disc and in the middle of the sun wheel speed difference and relative motion, and sample is placed in the sun wheel drive of the loading gear wheel hole, thus the were double-sided grinding and polishing.
