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Unipol-1502 Precision Automatic Lapping / Polishing Machine

Product ID:SYZY/XJpm004

Price: Please inquire PDF Format
Supply Ability:20SETS/MON
Port:SHENZHEN
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  • Product Introduction
  • Consulting
  • Model NumberUnipol-1502
    Brand NameYIMA
    Payment TermsT/T, paypal
    Brief introduction
    EQ-UNIPOL-1502 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three work stations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples. 
    Technical parameters
    Voltage AC 110V and 208-240V (50/60Hz) switchable for worldwide
     operation.
    Power 400W
    Two Super Flat Lapping Plate Flatness< 0.25 micron / Inch²
    Precision Rotating Shaft Running off < 5 micron
    Features One cast iron plate for lapping and one cast aluminum
    plate forpolishing
    Heavy duty cast aluminum case with bright painting
    Three rocking work stations with wafer holders and condition
     rings.
    They can be controlled independently for polishing 3 pcs of  4"
    wafers or 9 pcs of 2" wafers in one running
    Adjustable Timer for Auto-stop 0~99 hours
    Variable Speed 0 to 80 RPM with digital display
    Optional Accessories Consumables for polishing/lapping/grinding (sand paper,
    pad, plate,
    slurry, molding, coolant, etc) 
    Accessory equipment (slurry feeder, carrier/chuck,
    thickness meter, weights, etc) 
    4" Polishing Fixture With Pressure Indicator for
    Precision / Automatic
    Thinning and Polishing- EQ-PF-4-1P is available at extra cost
    Compliance CE Certified
    MET Certification (UL 73 Standard) is available upon request at
     extra cost.
     Please contact our sales representatives for a price quote.
     
     

     
  • Brief introduction
    EQ-UNIPOL-1502 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three work stations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples. 
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