HP200-SE program-controlled glue baking machine Introduction: The HP200-SE glue baking machine is a glue baking equipment designed by Jiangsu Leibo Scientific Instrument Co., Ltd., which has high thermal uniformity and temperature control. It can store 100 sets of programs, with each set of programs up to 5 steps. All operating parameters such as heating time and selection of lifting height can be conveniently set on the touch screen. Product parameters: 1. Hard anodized aluminum panel, panel size: 320mm * 320mm, suitable for 12 "round crystal substrate baking glue 2. Temperature regulation range: room temperature to 300 ℃, temperature resolution: 0.1 ℃ 3.7-inch full-color touch screen, advanced PLC control, temperature control accuracy up to ± 0.2 ℃ 4. Close to baking glue mode with lifting function, lifting height range: 0-30mm controllable, electric needle height resolution: 0.1mm 5. The ejector pin can be used for circular or square substrates with a diameter or inscribed circle diameter greater than 80mm 6.1KW cast aluminum high uniformity heating component, surface temperature uniformity of the hot plate: ± 2% in the working area 7. Can store 100 sets of baking glue formulas, each with 5 heating stages, adjustable heating time and top needle height 8. Dimensions: 303 (W) * 446 (D) * 295 (D)
Introduction: The HP200-SE glue baking machine is a glue baking equipment designed by Jiangsu Leibo Scientific Instrument Co., Ltd., which has high thermal uniformity and temperature control. It can store 100 sets of programs, with each set of programs up to 5 steps. All operating parameters such as heating time and selection of lifting height can be conveniently set on the touch screen.
