Introduction: The TC-24/H(b) gene thermal cycler is a member of the TC series thermal cycler family. The TC-24/H(b) thermal cycler has excellent performance, compact structure, and friendly operation interface. , Reliable results and other concepts. Especially in terms of temperature rise and fall speed, temperature control accuracy, and module uniformity, the TC-24/H(b) gene thermal cycler has shown its excellent performance. Large 320*240 dot matrix LCD screen, graphical display of program settings and operating curves, clear interface. Through the company's mature application of Peltier technology, the use of TAS technology has made a breakthrough leap in temperature uniformity between holes. Technical Parameters: Product name: Gene cycler Product model: TC-24/H(b) Sample size: 24*0.2ml 8 rows of tubes Temperature range: 4℃~105℃ Temperature rise and fall rate (Max.): ≥5.0℃/sec TAS technology application: Yes Module temperature uniformity: ≤±0.2℃ Temperature range of heating lid: 30℃~110℃ adjustable Heating lid pressure adjustment function: Yes Temperature control mode: BLOCK, analog TUBE mode Screen display: 320*240 dot matrix LCD Program graphic display function: Yes Program storage: 100 files Maximum number of segments: 5 Maximum steps: 16 Maximum number of cycles: 99 Input power: 220V~50Hz, 600W Dimensions (L*W*H): 297*212*200 (L*W*H) Net weight: 3.2Kg Signal interface: RS232
Introduction: The TC-24/H(b) gene thermal cycler is a member of the TC series thermal cycler family. The TC-24/H(b) thermal cycler has excellent performance, compact structure, and friendly operation interface. , Reliable results and other concepts. Especially in terms of temperature rise and fall speed, temperature control accuracy, and module uniformity, the TC-24/H(b) gene thermal cycler has shown its excellent performance. Large 320*240 dot matrix LCD screen, graphical display of program settings and operating curves, clear interface. Through the company's mature application of Peltier technology, the use of TAS technology has made a breakthrough leap in temperature uniformity between holes.
