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SYJ-800 CNC Dicing Cutting Machine for Crystal, ceramic, glass

Product ID:GJZqiege009

Price: Please inquire PDF Format
Supply Ability:20SETS/MON
Port:SHENZHEN
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  • Product Introduction
  • Consulting
  • Model NumberSYJ-800
    Brand NameSYKJ
    Payment TermsT/T, paypal
    Brief introduction
    SYJ-800 is a CE certified dicing saw,  designed for dicing and cutting almost all kinds of materials up to 8" diameter wafer or 8" L x 8" W x 1" H components. The SYJ-800 saw can be programmable by computer with position accuracy of 0.01 mm in X, Y.Z three dimension and the sample stage can be rotated by an electric motor to cut sample at  any angle with +/- 0.5° tolerance.  It is an excellent tool for dicing Al2O3 ceramic sheet and Si or Ge wafer for electronic substrates and solar power panels.  ( updated 6" blade and water splashing protect box since 3/25/2015 )
    Technical parameters
    Voltage AC 110V  (AC 220V 50/60Hz is available with ordering a 500W transformer)
    Motor 1/2 HP high torque DC motor (110V) with 0-3000.RPM
    Effective Dicing Range ·     Dicing Area :    X-axis: 8"      Y-axis:8"  
    ·     Dicing Depth:   depended on cutting blade diameter:
    4" Blade's Max. dicing depth <=   2 mm
    6" Blade's Max. dicing depth <=   20mm
    If sample area <= 2"x 2",  cutting depth can reach Max. 2" by 6" blade and suitable flange
    ·     Rotation: 360°  by motor (rotate speed/degree programmable)
    Accuracy     0.0025 mm moving resolution and 0.01 mm position accuracy.

    Dicing Blades   
    ·     Two diamond blades are included:
    One 4" Dia x 0.35mm (thickness) x 0.5" arbor  fully sintered diamond blade 
    One 6" Dia x 0.35mm (thickness) x 0.5" arbor edge sintered diamond blade
    ·     Two water splashing protectors are included. One for 4" blade and the another one is for 6" blade
    ·     Dicing blades are consumable, please click picture below to order spare
    PC software ·     Labtop and PC software are provided with the equipment. 
    ·     Cutting parameters can be set in the software such as cutting length, width, time, feed speed,  kerf loss, etc. Rotation is controlled independently.
    ·     Manual or programmable control mode
    ·     compatible with Win 7 / 8 / 8.1

    Sample Stage and Holder
    One 220mm diameter glass sample plate and 8" vacuum chuck are included
    ( The glass sample plate has a flat surface which can be soaked and hold in position by a vacuum chuck. Also, the glass plate can prevent the vacuum chuck from being damaged by saw blade during cutting process.)
    Water Cooling Assemblies of water jetting, draining, and splashing protection is included.
    Net Weight 90 kg
    Shipping Weight 290 lbs
    Dimensions Machine: 740 x570 x700 mm
    Control box: 340 x260 x190 mm
    Shipping Dimension 55''x39"x44"
    Warranty  One year limited with lifetime support --- including all electronic and mechanical parts. Damaged parts caused by misuse: such as rusted part from inadequate storage and broken parts by the user are not covered by the standard warranty.
    Certification CE Certified
     
     
     
  • Brief introduction
    SYJ-800 is a CE certified dicing saw,  designed for dicing and cutting almost all kinds of materials up to 8" diameter wafer or 8" L x 8" W x 1" H components. The SYJ-800 saw can be programmable by computer with position accuracy of 0.01 mm in X, Y.Z three dimension and the sample stage can be rotated by an electric motor to cut sample at  any angle with +/- 0.5° tolerance.  It is an excellent tool for dicing Al2O3 ceramic sheet and Si or Ge wafer for electronic substrates and solar power panels.  ( updated 6" blade and water splashing protect box since 3/25/2015 )
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