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RTP-3-04 Desktop 4-inch Rapid Annealing Furnace

Product ID:SYJRGZsyl060

Price: Please inquire PDF Format
Supply Ability:50 SETS/MON
Port:SHENZHEN
  • Product Introduction
  • Other information
  • Model NumberRTP-3-04
    Brand NameWHJIAYITONG
    Payment TermsTT,PAYPAL,Alibaba.com Pay
    RTP-3-04 Desktop 4-inch Rapid Annealing Furnace
    Introduction:
    The RTP-3-04 series rapid annealing furnace adopts infrared radiation heating technology, which can achieve rapid heating and cooling of large-sized samples (4-inch samples). At the same time, it is equipped with an ultra high precision temperature control system, which can achieve excellent temperature field uniformity. It plays an important role in the research and production of rapid heat treatment (RTP), rapid annealing (RTA), rapid thermal oxidation (RTO), rapid thermal nitriding (RTN) and metal alloying of materials.
    Product application: Metal electrode alloying; Stress relief annealing of hard alloy thin films; Graphene growth; Device annealing RTP; Material recrystallization and crystallization; Thermal oxidation RTO, thermal nitriding RTN; Densification of ITO film; Applied to ultra clean rooms; Thin film CVD growth; Equipped with an electrical testing module for variable temperature resistance measurement; Plasma injection/contact annealing; Solar cell bonding; Low dielectric material heat treatment; RTA for chip wafer heat treatment; Bonding furnace/alloy furnace; Other thermal process requirements.
    Technical features:
    1. Can measure large-sized samples: The size of single crystal samples that can be measured is 1-4 inches.
    2. Remote operation: Provides remote monitoring module.
    Innovative design of pressure control system: high-precision control of pressure to meet different process requirements.
    4. Storage heat treatment process: facilitates the retrieval of process parameters, improves experimental efficiency, and data can be queried.
    5. Fast temperature control and high vacuum: The highest heating rate can reach 150 ℃/s, and the highest vacuum degree can reach 10-3Pa.
    6 Program settings and gas path expansion: It can achieve precise control of different temperature ranges, automatically switch between cooling ranges, and save process menus for easy access. Using MFC to precisely control gas flow and achieve heat treatment in different atmospheric environments (vacuum, nitrogen, etc.).
    7 unique cavity space design: ensuring temperature field uniformity of large-sized samples ≤ 1%.
    8. Fully automatic intelligent control: adopting fully automatic intelligent control, including temperature, time, gas flow rate, vacuum, cooling water, etc., all of which can be automatically controlled.
    9. Ultra high safety factor: Adopting triple safety measures of furnace door safety temperature opening protection, temperature controller opening permission protection, and equipment emergency stop safety protection, comprehensively ensuring the safety of equipment use.
    10 Domestic Annealing Furnaces: With independent research and development technology and manufacturing capabilities, they can quickly respond to customer after-sales needs.

     
     

     
  • Introduction:
    The RTP-3-04 series rapid annealing furnace adopts infrared radiation heating technology, which can achieve rapid heating and cooling of large-sized samples (4-inch samples). At the same time, it is equipped with an ultra high precision temperature control system, which can achieve excellent temperature field uniformity. It plays an important role in the research and production of rapid heat treatment (RTP), rapid annealing (RTA), rapid thermal oxidation (RTO), rapid thermal nitriding (RTN) and metal alloying of materials.
    Product application: Metal electrode alloying; Stress relief annealing of hard alloy thin films; Graphene growth; Device annealing RTP; Material recrystallization and crystallization; Thermal oxidation RTO, thermal nitriding RTN; Densification of ITO film; Applied to ultra clean rooms; Thin film CVD growth; Equipped with an electrical testing module for variable temperature resistance measurement; Plasma injection/contact annealing; Solar cell bonding; Low dielectric material heat treatment; RTA for chip wafer heat treatment; Bonding furnace/alloy furnace; Other thermal process requirements.
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