| Parameter | Specification |
| Model | MSK-SP-04-LD |
| Equipment Type | Ultrasonic Spray Pyrolysis Thin Film Coating Machine |
| Input Power | 208–240 V AC, 50/60 Hz |
| Installation Power Requirement | AC 220 V, 50 Hz, with proper grounding |
| Stepper Motor | 24 V DC |
| Ultrasonic Atomizer Frequency | 40 kHz |
| Ultrasonic Atomizer Power | 130 W |
| Solution Container Capacity | 50 mL and 250 mL |
| Solution Delivery Rate | 1–20 mL/s, as specified by the source |
| Droplet Size | 50 μm, as specified by the source |
| Spray Head Travel | 200 mm along X and Y axes |
| X-Axis Movement Speed | 10–800 mm/s |
| Y-Axis Movement Speed | 1–12 mm/s; air-compressor-driven movement is specified in the source |
| Substrate Stage Size | 150 × 150 mm |
| Maximum Heating Temperature | 500°C |
| Temperature Controller | Digital display with seven-stage programmable heating and cooling |
| Overall Dimensions | 840 × 920 × 1,400 mm |
| Cooling Water | Not required |
| Compressed Gas | Not required according to the installation requirements |
| Operating Altitude | Below 1,000 m |
| Ambient Temperature | 25°C ± 15°C |
| Relative Humidity | 55% RH ± 10% RH |
| Installation Footprint | Floor-standing; more than 1 m² of floor space required |
| Ventilation | Required |
| Feature | MSK-SP-04-LD Ultrasonic Spray Pyrolysis | Conventional Spin Coating | Vacuum-Based Deposition |
| Deposition Approach | Atomized solution sprayed onto a heated substrate | Liquid spread by substrate rotation | Material deposited under vacuum |
| Substrate Heating | Integrated heating up to 500°C | Depends on separate equipment or configuration | Depends on deposition technology |
| X-Y Spray Movement | Available | Not typically used | Depends on system |
| Solution-Based Processing | Yes | Yes | Depends on method |
| Typical Research Applications | Oxide films, transparent electrodes, perovskite-related coatings | Small-area solution-coated films | Thin films requiring vacuum processing |
| Process Flexibility | Adjustable solution delivery, spray movement, and heating program | Primarily controlled by solution and spin parameters | Depends on deposition process and equipment |