| Grinding Method |
High-energy horizontal oscillation |
Varies |
| Grinding Modes |
Dry and wet |
Often primarily dry |
| Grinding Platforms |
2 simultaneously |
Usually 1 |
| Final Particle Size |
Up to approximately 5 μm |
Depends on equipment |
| Program Memory |
6 programs |
Often limited |
| Frequency Adjustment |
3–20 Hz |
Usually limited |
| Grinding Time |
0–99 min |
Varies |
| Cross-Contamination |
Closed grinding jars reduce risk |
Depends on design |
| Wet Grinding Sealing |
Spiral leak-resistant lid |
Depends on configuration |
| Sample Heating |
Short grinding time helps reduce heating |
May generate more heat |
| Maintenance |
Easy jar removal and cleaning |
Varies |