ETD-800 Fully Automatic Ion Sputtering Machine Introduction The ETD-800 fully automated plasma sputtering system is a coating device specifically designed for scanning electron microscope users. It features easy operation, uniform film deposition, and short processing times. Its compact size and one-touch operation enable precise thickness control, making it suitable for field emission scanning electron microscopes. The system supports a variety of target materials, such as Au, Pt, Cr, Al, and Cu, and effectively protects electron beam-sensitive samples while improving imaging quality for non-conductive samples. Features: The ETD-800 fully automatic plasma sputtering machine boasts an elegant appearance and exquisite craftsmanship, 2. The chassis size is only 310mm x 260mm x 115mm. 3. The ETD-800 mini ion sputter is a fully automated coating device specifically designed for scanning electron microscope users; 4. Simple operation: press one button to start after placing the sample; the digital counter meets precise timing requirements. 5. Particularly suitable for field emission scanning electron microscopes with high requirements on membrane particle size. 6. It features advantages such as uniform film formation, simple operation, short processing time, and controllable process. 7. Target materials such as Au, Pt, Cr, Al, and Cu can be used. 8. Equipped with a high-position qualitative飞跃 vacuum pump Technical parameters: Host dimensions: 260mm × 307mm × 260mm (W × D × H) Power supply specifications: 220V (can be adjusted to 110V), 50Hz Target (upper electrode): 50mm × 0.1mm (D × H) Target: Au (standard configuration), with options for silver or platinum targets based on actual requirements. Vacuum sample chamber: Borosilicate glass 115mm × 100mm (D × H) Timer: Maximum duration: 3600S Mechanical pump: 1L/S Maximum voltage: -1200 DCV
Introduction The ETD-800 fully automated plasma sputtering system is a coating device specifically designed for scanning electron microscope users. It features easy operation, uniform film deposition, and short processing times. Its compact size and one-touch operation enable precise thickness control, making it suitable for field emission scanning electron microscopes. The system supports a variety of target materials, such as Au, Pt, Cr, Al, and Cu, and effectively protects electron beam-sensitive samples while improving imaging quality for non-conductive samples.
