| Parameter | Specification |
| Product Model | ETD-2000MH |
| Equipment Type | Magnetron Sputtering Coater |
| Vacuum Pump | Turbo molecular pump (80 L/s pumping speed) + 2 L rotary vane vacuum pump |
| Standard Target Material | Gold target |
| Target Size | Diameter 60 mm × Thickness 0.1 mm |
| Optional Targets | Silver target, Platinum target, and other metal targets |
| Sputtering Current | 0–500 A |
| Ultimate Vacuum | 5 × 10 Pa |
| Sample Chamber Size | Diameter 180 mm × Height 200 mm |
| Sample Stage Size | Diameter 80 mm |
| Power Supply | 220 V, 50 Hz (110 V optional) |
| Feature | ETD-2000MH Magnetron Sputtering Coater | Traditional Vacuum Evaporation Coater |
| Coating Method | Plasma magnetron sputtering | Thermal evaporation |
| Film Uniformity | High uniformity and strong adhesion | Depends strongly on evaporation direction |
| Sample Temperature | Low temperature rise | Higher thermal impact |
| Material Compatibility | Suitable for various metals | Limited by evaporation characteristics |
| SEM Sample Preparation | Excellent | Moderate |
| Conductive Coating Quality | High-density metal film | May have weaker adhesion |